| 栾庆磊,屈紫浩,郭继智,史艳琼,陈中.基于有限元法的半桥IGBT混合模块的可靠性分析与优化设计[J].安徽建筑大学学报,2024,32(): |
| 基于有限元法的半桥IGBT混合模块的可靠性分析与优化设计 |
| Reliability Analysis and Optimal Design of Half-bridge IGBT Hybrid Module Based on Finite Element Method |
| 投稿时间：2023-09-07 修订日期：2023-12-11 |
| DOI： |
| 中文关键词: IGBT混合模块 结温 热应力 有限元 封装可靠性 |
| 英文关键词: IGBT hybrid module junction temperature thermal stress finite element method package reliability |
| 基金项目:安徽省科技重大专项 |
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| 中文摘要: |
| 随着IGBT模块功率密度的提升，模块受到的温度、热应力冲击也越来越严重。为了避免过高的温度和热应力使模块内部材料疲劳失效，使电力系统发生非计划停机事故。本文建立硅基IGBT与碳化硅基JBS组成的半桥IGBT混合模块的有限元仿真模型，通过改变芯片排列位置、各层结构的厚度，以及焊料和陶瓷基板的材质，计算分析模块结温及最大热应力变化规律，并对模块封装结构进行优化。经过仿真计算，优化后模块的结温与最大热应力分别下降18 ℃和80.2 MPa。从而提高了模块的可靠性，为高可靠性功率模块的生产提供了新思路。 |
| 英文摘要: |
| As the power density of the IGBT module increases, the temperature and thermal stress impact of the module are becoming more and more serious. In order to avoid excessive temperature and thermal stress to make the module internal material fatigue failure, so that the power system unplanned shutdown accident. In this paper, the finite element simulation model of half-bridge IGBT hybrid module composed of silicon-based IGBT and silicon carbide-based JBS is established. Calculate and analyze the change law of module junction temperature and maximum thermal stress and optimize the model packaging structure, which can be realized by changing the arrangement position of chips, the thickness of each layer structure, and the material of solder and ceramic substrate. It can be seen from simulation calculation that the junction temperature and maximum thermal stress of the optimized module decreased by 18 ℃ and 80.2 MPa respectively, which enhances the reliability of the module and provides a new idea for the production of high-reliability power modules. |
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