| 黄磊,张雨,陈雪辉,李昊.水速对水射流辅助激光加工碳化硅中能量利用率的影响研究[J].安徽建筑大学学报,2023,31(2):70-76 |
| 水速对水射流辅助激光加工碳化硅中能量利用率的影响研究 |
| Effects of Water Velocity on Energy Utilization Rate in Laser-water Composite Processing of Silicon Carbide |
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| DOI： |
| 中文关键词: 复合加工 碳化硅 激光刻蚀 槽体 |
| 英文关键词: composite processing silicon carbide laser etching groove |
| 基金项目:安徽省高校省级自然科学研究项目（KJ2019A0798）；安徽建筑大学自然科学项项目（2019QDZ20） |
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| 中文摘要: |
| 为了探究水速对水射流辅助激光加工碳化硅中能量有效利用率和槽体体积以及复合加工质量的影响，模拟入射角 45°时不同水速冲击材料产生的冲击作用，从理论上分析激光 - 水 - 材料间的冷却和冲击作用，借助有限元软件模拟不同水速对材料的冲击作用并通过实验验证。结果表明：单纯激光刻蚀时，加工槽体体积较大，槽体底部堆积大量熔渣，同时槽体壁面存在较多重铸层，加工质量较差；随着水速不断增大，复合加工槽体体积呈先减小再增大最后再减小的规律，能量有效利用率也呈现相同趋势；水速为 8 m·s-1 时，复合刻蚀体积和有效能量利用率较空气中激光加工均有所减小，槽体底部小部分熔渣被去除，重铸层呈现沟壑状；水速为 24 m·s-1 时，复合加工槽体的体积和有效能量利用率均较大，底部熔渣堆积较少，同时壁面重铸层大量减少，加工质量较好。 |
| 英文摘要: |
| In order to explore the influence of water velocity on the energy utilization rate，the volume of groove and the quality ofcomposite processing in waterjet-assisted laser processing of silicon carbide，the effect of different water velocities impacting the materialat an incident angle of 45 °was simulated， and the cooling and impact among laser，water，material were analyzed theoretically，and verified at different water velocities by finite element software. The results show that with laser etching merely，the processingquality is poor because of the large volume of groove，the accumulation of large amounts of slag at the bottom，and more recast layerson the wall of the groove. With the increase of water velocity，the volume of the composite groove as well as the energy utilization ratedecreases first，then increases and finally decreases. When the water velocity is 8 m·s-1，the composite etching volume and effectiveenergy utilization rate decrease compared to laser processing merely，as a small part of slag is removed from the bottom and the wavyrecast layers are formed. When the water rate is 24 m·s-1，the volume and effective energy utilization of the composite groove areimproved，with less slag accumulation at the bottom and lesser recast layers on the wall，representing the better processing quality. |
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