文章摘要
孙小燕,赵浩,潘培道,汪列隆.Cu-Ti3SiC2复合材料真空热压法制备及性能研究[J].安徽建筑大学学报,2020,28(1):73-77
Cu-Ti3SiC2复合材料真空热压法制备及性能研究
Preparation and Properties of Cu-Ti3SiC2 Composites by VacuumThermal Pressure Method
  
DOI:10.11921/j.issn.2095-8382.20200112
中文关键词: Cu-Ti3SiC2  烧结  复合材料  性能
英文关键词: Cu-Ti3SiC2  sintering  composite material  performance
基金项目:安徽省教育厅高校自然科学研究重点项目(KJ2018A0581)。
作者单位
孙小燕 池州学院机电工程学院安徽池州247000 
赵浩 合肥工业大学材料与工程学院安徽合肥230009 
潘培道 池州学院机电工程学院安徽池州247000 
汪列隆 池州学院机电工程学院安徽池州247000 
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中文摘要:
      Ti3SiC2 是一种具有MAX 层状结构的先进材料,兼具金属与陶瓷的双重性能。将Ti3SiC2 作为弥散强 化相与Cu 复合制备金属基复合材料,综合力学性能较好,有望在电接触材料中有较好的应用前景。采用热压 烧结法制备Cu-Ti3SiC2 复合材料,试验证明Cu-Ti3SiC2 复合材料的最佳烧结工艺为:烧结温度750 ℃,压力 30 MPa,保温30min,制得复合材料的组织均匀,团聚较少。其次研究了Ti3SiC2 含量对复合材料硬度、电阻 率等性能的影响,随着Ti3SiC2 的体积分数的增加,硬度先增加后降低,相对密度和抗弯强度呈减小趋势,电 阻率增加;通过微观显微分析,Cu-Ti3SiC2 致密度随Ti3SiC2 含量增加而下降。
英文摘要:
      Ti3SiC2 is an advanced material with MAX layered structure,which has the dual properties of metal and ceramic. Ti3SiC2 was used as dispersion strengthening phase and Cu to prepare metal matrix composites,which has good comprehensive mechanical properties and is expected to have a good application prospect in electrical contact materials. The best sintering process of Cu-Ti3SiC2 composite was proved to be as follows:sintering temperature 750℃ ,pressure 30 MPa,insulation 30min. The composite was prepared with even structure and less agglomeration. Secondly,the effect of Ti3SiC2 content on the properties of composite materials such as hardness and resistivity was studied. With the increase of Ti3SiC2 volume fraction,hardness first increased and then decreased. Through microscopic analysis,the density of Cu-Ti3SiC2 decreased with the increase of Ti3SiC2 content.
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